Thank you for attending SEMICON Singapore 2008 conference.

We are pleased to share with you the presentation slides. Please click on the individual presentation title to view the slides.

Due to confidentiality, some presentation slides were not uploaded upon speaker’s request.

8th Semiconductor Market Trends Briefing

[The Future of the Disk Drive Industry: Is it Solid?] – Mr David Reinsel, IDC
[Trends in Semiconductor Packaging Materials] – Ms Jan Vardaman, TechSearch International, Inc.
[Semiconductor Equipment and Materials Outlook] – Mr Dan Tracy, SEMI Global Headquarters

S1 – Advanced Packaging Technologies (Day 1 of 2)

[Keynote: “Lower Cost” Packaging Technologies: Exploring the benefits of Copper Wire Bonding] – Ms Jean Ramos, Unisem
[Revolutionary Approach to Die Attach] – Mr Christian Saner, Oerlikon Esec
[Copper Wirebond Outlook] – Ms L C Tan, Freescale Semiconductor (M) Sdn Bhd
[Wire Bond Reliability – An overview of Intermetallic Mechanism] – Mr Jamin Ling, Kulicke & Soffa

S2 – Advanced Packaging Technologies (Day 2 of 2)

[Keynote: Main Drivers of New Packaging Technology Trends] – Mr Mario Bolanos, Texas Instruments
[3D Packaging and the Future of TSV Technology] – Ms Jan Vardaman, TechSearch International, Inc.
[3D Integration with TSV Technology] – Dr Yoon Seung Wook, Institute of Microelectronics
[3D System-in-Package (SIP) Technology Overview] – Dr Hsueh-An Yang, ASE Inc. (Taiwan)

S3 – Test Technologies

[Keynote: Trends, Market Drivers and Outlook – IC Assembly and Test, 2008 and Beyond] – Mr Michael W. Schraeder, Stats ChipPAC Inc.
[Semiconductor Failure Analysis for 60 Years and Beyond] – Mr Xue Ming, Infineon Technologies
[Parallel RF Testing for Multi-band Transceiver] – Mr Tan Eng Keong, Verigy Limited
[Efuse Methodology and Characterization] – Mr Alan Lek, Chartered Semiconductor Manufacturing Ltd
[RF SoC Testing] – Ms Jaime Liang, LTX Asia International Inc.
[Probe Designs for Fine Pitch Applications – Kelvin and Wafer-Level Test] – Mr Jim Brandes, Everett Charles Technologies

S4 – Wafer Processing Technologies

[Dainippon Screen Cleaning Technology for Next Generation’s Device] – Mr Soichi Nadahara, Dainippon Screen Manufacturing Co Ltd
[Featured: Competing in a Global NAND Market through Strategic Partnerships] – Mr Rodney Morgan, IM Flash Technologies, LLC

Solar Energy, Photovoltaic Manufacturing – Growth Opportunity Present for Semiconductor Industry

[Keynote: Overview on the Entire Solar Cells Policy and Industry Internationally] – Dr Murray Cameron, Phoenix Solar AG
[Accelerating Solar: Advances in Thin Film and cSi Manufacturing] – Mr Jonathan C. Pickering, Applied Materials, Inc.
[Solutions for a Solar Powered World] – Dr Haiyan Sun, Oerlikon (Shanghai) Co. Ltd
[Photovoltaic Technology – Where are we heading?] – Prof. Eicke R. Weber, ISE
[R&D on Photovoltaic in Singapore – Status and Plans] – Prof. Joachim Luther, Solar Energy Research Institute of Singapore

Semiconductor Applications Technology Symposium

[Bio-Microfludic Cartridge for a DNA Lab on a Chip (LOC) Application] – Mr C S Premachandran, Institute of Microelectronics
[Keynote: From Micro to Nanoelectronics – Disruption, Convergence or Evolution?] – Mr Tim Harper, Cientifica Ltd

Manuscripts

[Keynote: “Lower Cost” Packaging Technologies: Exploring the benefits of Copper Wire Bonding] – Ms Jean Ramos, Unisem
[New Materials for Bonding Wire] – Dr Moon Jeong Tak, MK Electron Co Ltd, Korea
[Revolutionary Approach to Die Attach] – Mr Christian Saner, Oerlikon Esec
[Wire Bond Reliability – An overview of Intermetallic Mechanism] – Mr Jamin Ling, Kulicke & Soffa
[Keynote: Main Drivers of New Packaging Technology Trends] – Mr Mario Bolanos, Texas Instruments
[3D Integration with TSV Technology] – Dr Yoon Seung Wook, Institute of Microelectronics
[Semiconductor Failure Analysis for 60 Years and Beyond] – Mr Xue Ming, Infineon Technologies
[Efuse Methodology and Characterization] – Mr Alan Lek, Chartered Semiconductor Manufacturing Ltd
[RF SoC Testing] – Ms Jaime Liang, LTX Asia International Inc.
[Nanotechnology and Fluoropolymers] – Mr Wilson Sia, Perlast Ltd