SEMI Technology Symposium (STS)

S1—Advanced Packaging Technologies (Day 1 of 2)

Event Code:	STS—S1
Date: Time: Location:	Tuesday, 6 May 2008 09:30–12:40 Level 3, Suntec Singapore

Session Chair: Ms Mary Ong General Manager/Corporate VP, International Marketing Small Precision Tools/ SPT Asia Pte Ltd

	[09:30 – 10:30] Keynote: "Lower Cost" Packaging Technologies: Exploring the benefits of Copper Wire Bonding Ms Jean Ramos Chief Technology Officer Unisem
	[10:30–11:00] New Materials for Bonding Wire Dr Moon Jeong Tak Chief Technology Officer MK Electron Co Ltd, Korea
	[1100–11:10] Break
	[11:10–11:40] Revolutionary Approach to Die Attach Mr Christian Saner Senior Process Engineer Oerlikon Esec
	[11:40–12:10] Copper Wirebond Outlook Ms L C Tan Regional R&D Manager Freescale Semiconductor (M) Sdn. Bhd
	[12:10–12:40] Wire Bond Reliability – An overview of Intermetallic Mechanism Mr Jamin Ling Director of Bonding Wire R&D Kulicke & Soffa

Programmes are subjected to change without prior notice